Rogers RT/duroid 6035HTC 2-Layer 30mil High Thermal Conductivity PCB with Immersion Silver

1.Introduction of Core

Rogers RT/duroid 6035HTC high frequency circuit materials are ceramic filled PTFE composites for use in high power RF and microwave applications. They are an exceptional choice for high power applications. The laminates have a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and copper foil (ED and reverse treat) with excellent long term thermal stability. Additionally, Rogers advanced filler system enables excellent drill-ability, reducing drilling costs as compared to standard high thermally conductive laminates that use alumina fillers.

2.Key Features

DK of 3.5 +/- 0.05 at 10 GHz/23°C
Dissipation factor of 0.0013 at 10 GHz/23°C
Thermal Coefficient of dielectric constant of -66 ppm/°C
Moisture Absorption 0.06%
Thermal Conductivity of 1.44 W/m/K at 80°C
CTE in X-axis of 19 ppm/°C, Y-axis of 19ppm/°C and Z-axis of 39ppm/°C

3.Benefits

High Thermal conductivity (1.44 W/m/K) - 2.4x higher than standard RT/duroid 6000 products
Improved dielectric heat dissipation enables lower operating temperatures for high power applications
Excellent high frequency performance with low dissipation factor (0.0013)
Lower insertion loss and excellent thermal stability of traces
Advanced filler system enables excellent drill-ability, reducing drilling costs
Copper foil options with excellent long term thermal stability

4.PCB Construction Details

5.PCB Stackup (2-Layer Rigid Structure)

Copper layer 1 – 35 μm
RT/duroid 6035HTC – 0.762 mm (30mil)
Copper layer 2 – 35 μm

6.PCB Statistics:

Components: 31
Total Pads: 104
Thru Hole Pads: 73
Top SMT Pads: 31
Bottom SMT Pads: 0
Vias: 86
Nets: 2

7.Typical Applications

High power RF and microwave amplifiers
Power amplifiers, couplers, filters, combiners, power dividers

8.Quality Assurance

Artwork supplied: Gerber RS-274-X
Accepted standard: IPC-Class-2
Availability: Worldwide